Application Field Product Model Mix Ratio (Volume Ratio) Product Features
General Purpose EA-306 A/B A:B=1:1 Widely used for bonding various materials such as metal, ceramic, glass, rubber, various hard plastics, and most common materials
High Thixotropy EA-306HT-A/B A:B=1:1 Does not flow after application, effectively maintaining the shape and thickness of the adhesive layer
High Transparency
Optical Applications		 EA-307 A/B A:B=2:1 Low shrinkage at room temperature, forming a highly transparent adhesive layer suitable for industries requiring optical clarity
High Performance
Industrial Applications		 EA-308H-A/B A:B=2:1 High bonding strength, excellent thermal shock reliability, temperature resistance above 150℃, suitable for most industrial applications
Semiconductor Industry
Electronic Component Bonding		 EA-321 Single Component Low viscosity, excellent anti-collapse after application, outstanding bonding strength, insulation resistance, and resistance to acids and alkalis, good thermal shock reliability
Industrial products with thermal conductivity requirements, automotive parts, structural bonding of metals EA-325W Series Single Component High heat-resistant epoxy adhesive, high thermal conductivity coefficient, high bonding strength at high temperatures, high retention rate of bonding strength after high temperature and humidity
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