Application Field Product Description Product Model TG (°C) Product Features Mixed Viscosity
Inductive Adhesive Suitable for bonding magnetic powder and surface protection of various high-pressure formed electronic components ES-1013 A/B 110±10℃ Conventional cold-press product 300±100cps
Inductive Adhesive Suitable for bonding magnetic powder and surface protection of various high-pressure formed electronic components ES-1014 A/B 110±10℃ High-toughness cold-press product 600±150cps
Inductive Adhesive Suitable for bonding magnetic powder and surface protection of various high-pressure formed electronic components ES-1089 A/B >180℃ Conventional hot-press product, low viscosity <100cps
Inductive Adhesive Suitable for bonding magnetic powder and surface protection of various high-pressure formed electronic components ES-1094 A/B >170℃ Hot-press product with heat resistance and toughness <200cps
Inductive Adhesive Suitable for bonding magnetic powder and surface protection of various high-pressure formed electronic components ES-1095 A/B >150℃ High-toughness hot-press product with excellent crack resistance <250cps
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